| Part No. | Den. | Org. | Voltage | Package | Dim.(mm) | Status | Speed | Temperature | Model |
|---|---|---|---|---|---|---|---|---|---|
SCE11U64324EF ![]() |
64Gb |
2048Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
ES |
3733/4266 |
I ,A3 ,A2 |
|
SCE11U48324AF ![]() |
48Gb |
1536Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
ES |
3733/4266 |
I ,A3 ,A2 |
|
SCE11U32322EF ![]() |
32Gb |
1024Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
ES |
3733/4266 |
I ,A3 ,A2 |
|
SCE11U32322FF ![]() |
32Gb |
1024Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
ES |
3733/4266 |
I ,A3 ,A2 |
|
SCB11R32322EF ![]() |
32Gb |
1024Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3733/4266 |
C,I |
|
SCB11R32324CF ![]() |
32Gb |
1024Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3733/4266 |
C |
|
SCB11R24324CF ![]() |
24Gb |
768Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3733/4266 |
||
SCE11U16320FF ![]() |
16Gb |
512Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
ES |
3733/4266 |
I ,A3 ,A2 |
|
SCB11R16322CF ![]() |
16Gb |
512Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3733/4266 |
C |
|
SCE11R8G322AF- ![]() |
8Gb |
256Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3200/2400/1600 |
I A3 A2 |
|
SCE11R4G160AF- ![]() |
4Gb |
256Mbx16 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3200/2400/1600 |
I A3 A2 A1 |
|
SCE11R4G320AF- ![]() |
4Gb |
128Mbx32 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3200/2400/1600 |
I A3 A2 A1 |
|
SCE11R2G160AF- ![]() |
2Gb |
128Mbx16 |
1.1V |
TFBGA200 |
10x14.5 |
MP |
3200/2400/1600 |
I A3 A2 A1 |
C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C;SDR, DDR: 0°C ~ +70°C)
I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)
A1 = Automotive grade 1(-40°C ~ +125°C)
A2 = Automotive grade 2(-40°C ~ +105°C)
A25 = Automotive grade 2(-40°C ~ +115°C)
A3 = Automotive grade 3(-40°C ~ +95°C);LPDDR4(-40°C ~ +85°C)